New from bulk. No original box or paperwork. Has never been mounted.


  • Open top THT sockets for BGA packages with 1.00 mm pitch
  • Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
  • Tweezer contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls

Advantages

  • Open Top solution for very large BGA packages
  • Suitable for autoloading testing equipment

Specifications

General Specification
  • Mating Cycles
    10,000
  • Operating Temperature Range
    -40 °C – 150 °C
Electrical Specification
  • (Initial) Contact Resistance
    100 Milliohm
  • Insulation Resistance
    1000 Megaohm
  • (Dieletric) Withstanding Voltage
    100 V AC
  • Current Rating
    1 A
Interface Specification
  • Pitch
    1
  • Pin Count / Numbers of pins
    1,800